Semiconductor Procurement Glossary
Understand the terminology that drives electronic component sourcing decisions. From allocation to x-ray inspection — the essential vocabulary for procurement and supply chain professionals.
Procurement & Sourcing
Allocation
A manufacturer-controlled distribution model where components are rationed to customers based on historical volume, strategic importance, or contracted agreements. Common during shortages for FPGAs, MCUs, and analog ICs.
BOM (Bill of Materials)
A comprehensive list of all components, parts, and raw materials required to manufacture a product. In semiconductor procurement, BOM analysis identifies supply risks, EOL components, and single-source dependencies.
Last Time Buy (LTB)
The final opportunity to purchase a discontinued component directly from the manufacturer. After the LTB date, the part enters aftermarket distribution only. Strategic LTB planning is critical for long-lifecycle products.
Lead Time
The elapsed time between placing a purchase order and receiving the components. Standard semiconductor lead times range from 8-16 weeks; during shortages, some FPGAs and MCUs can extend to 52+ weeks.
PCN (Product Change Notification)
A manufacturer-issued notice of changes to component specifications, materials, packaging, or manufacturing location. PCNs can affect form/fit/function and require engineering review.
PPAP (Production Part Approval Process)
An automotive industry standard (part of IATF 16949) for qualifying new or changed parts before production. Changing semiconductor suppliers for automotive applications often requires full PPAP re-submission.
RFQ (Request for Quote)
A procurement document submitted to suppliers requesting pricing, availability, and delivery terms for specific components. RFQ-based models (like SupplyICs) allow customized pricing based on volume, delivery urgency, and market conditions.
Single-Source Component
A part available from only one manufacturer with no pin-compatible alternatives. Single-source components represent the highest supply chain risk and require strategic buffer stock planning.
Component Lifecycle
Active Component
A semiconductor device currently in full production by the original manufacturer, with no announced discontinuation plans. Active parts have standard lead times and full manufacturer support.
Date Code
A manufacturer marking indicating the production date of a semiconductor component. Format varies (YYWW, YYMM, etc.). Date code verification is a critical authenticity check — mismatched or implausible date codes signal counterfeits.
EOL (End of Life)
A manufacturer-issued notice that a component will be discontinued. EOL triggers a Last Time Buy window (typically 6-12 months), after which the part is no longer produced and only available through independent distribution.
NRND (Not Recommended for New Design)
A manufacturer status indicating a component is still in production but not recommended for new designs. NRND is a precursor to EOL. Designers should plan migration paths when components enter NRND status.
OCM (Original Component Manufacturer)
The company that designed and manufactured the original semiconductor component. Distinct from authorized distributors and independent brokers. Traceability to OCM is a key authenticity indicator.
Quality & Testing
AS6081
SAE Aerospace Standard for counterfeit electronic parts avoidance. Specifies inspection, testing, and authentication procedures for independent distribution. Widely adopted beyond aerospace as the benchmark for counterfeit prevention.
Co-Planarity
The condition where all leads or balls of a surface-mount package lie in the same plane. Critical for QFP and BGA soldering reliability. Inspected via automated 3D optical measurement before shipment.
Decapsulation
Chemical or mechanical removal of a semiconductor package to expose the internal die for microscopic inspection. Used in authenticity verification to compare die markings against manufacturer reference images.
ESD (Electrostatic Discharge)
The sudden flow of electricity between two objects caused by contact or dielectric breakdown. Semiconductor components are extremely ESD-sensitive. Handling must follow ANSI/ESD S20.20 protocols with grounded workstations.
JEDEC
Joint Electron Device Engineering Council — the semiconductor industry standards body. Publishes widely-adopted standards including J-STD-033 (moisture sensitivity) and J-STD-020 (reflow soldering).
MSL (Moisture Sensitivity Level)
A JEDEC classification (Level 1-6) indicating a component's susceptibility to moisture-induced damage during reflow soldering. Higher levels require baking and dry-pack storage. MSL violations cause "popcorning" — internal package delamination.
RoHS (Restriction of Hazardous Substances)
EU directive restricting the use of lead, mercury, cadmium, and other hazardous substances in electronic equipment. Compliance verification is mandatory for components shipped to EU markets.
X-Ray Inspection
Non-destructive imaging using X-rays to examine internal component structures: bond wires, die attach, lead frame, and internal voids. An essential counterfeit detection technique for high-value or high-risk components.
Components & Technology
Fab (Fabrication Plant)
A semiconductor manufacturing facility where silicon wafers are processed into integrated circuits. Advanced-node fabs (7nm and below) cost $15-25 billion. Mature-node fabs (28nm-65nm) average $3-6 billion.
FPGA (Field-Programmable Gate Array)
Reconfigurable integrated circuits that can be programmed after manufacturing. Key manufacturers include Xilinx (AMD) and Altera (Intel). FPGAs frequently face allocation due to limited manufacturing capacity.
MCU (Microcontroller Unit)
A compact integrated circuit containing a processor, memory, and programmable peripherals on a single chip. Widely used in automotive, industrial, and consumer electronics. Key manufacturers include NXP, Infineon, ST, Microchip, TI, and Renesas.
Tape & Reel
A packaging format where components are loaded into embossed carrier tape and wound onto reels. Standard for automated pick-and-place assembly. Alternatives include tray and tube packaging.
Industry Standards
Compound Price Specification
A schema.org type allowing markup of pricing that depends on multiple factors (volume, lead time, region). Used by SupplyICs instead of fixed $0.00 pricing since we operate on an RFQ model.
hreflang
An HTML attribute indicating language and geographic targeting for pages with multiple language versions. Essential for multi-language sites to prevent duplicate content issues across language variants.
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